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Heat soldering equipment - メーカー・企業と製品の一覧

Heat soldering equipmentの製品一覧

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[Induction Heating Application Cases by Industry] Solar Cells

Improving the soldering process in solar cell manufacturing! Introducing examples of high-frequency induction heating applications in the solar cell manufacturing process.

We would like to introduce a case study on the application of induction heating in solar cell manufacturing. The original specification of AroNix's IH (Induction Heating) high-speed soldering module improves the soldering process in solar cell manufacturing. **Features of the IH (Induction Heating) High-Speed Soldering Module:** - **Speed:** Soldering of busbars and interconnectors takes 0.1 to 0.3 seconds per location, and soldering of cell electrodes takes 1 to 2 seconds per location. - **High Control:** Startup time of 5 milliseconds, high-speed automatic frequency tuning with a compact induction heating power supply. - **Clean Heating:** Non-contact direct heating using the IH (Induction Heating) method. - **Energy Saving:** Power consumption is only during heating time, with no need for continuous output. - **Universal Power Supply:** The induction heating power supply is a standard production item, ensuring short delivery times and no maintenance concerns, making it suitable for production lines. - **Flexible Adaptability:** The head weighs approximately 2.6 kg, and the cable between the head and the induction heating power supply is about 4 meters. It can also be adapted for use in automated machines with robots. *For more details, please download the PDF or feel free to contact us.*

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  • Other heating equipment

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A 3D local heating IH soldering device that can also accommodate characteristic substrates!

Capable of outputting a large amount of heat, it can handle a wide range of substrates with just "one unit"! Compliant with various regulations such as ICNIRP and the Radio Law, 'S-WAVE301H'.

The "S-WAVE301H" is a product designed for spot heating printed circuit boards that require a large amount of heat. It can accommodate characteristic substrates such as busbars, power semiconductors, four-layer boards, high multilayer boards, thick copper boards, ceramic substrates, and metal base substrates. It retains features such as low power consumption and high heating efficiency. Please feel free to contact us when you need assistance. 【Features】 ■ Low power consumption, high heating efficiency ■ Spot heating for printed circuit boards that require a large amount of heat ■ Improvement of solder joint quality for power semiconductors ■ Improvement of solder joint quality for busbars ■ Compliance with various regulations such as ICNIRP and the Radio Law ■ Capability to accommodate characteristic substrates such as busbars and metal base substrates *For more details, please feel free to contact us.

  • Heating device

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